JPH0183769U - - Google Patents

Info

Publication number
JPH0183769U
JPH0183769U JP1987179536U JP17953687U JPH0183769U JP H0183769 U JPH0183769 U JP H0183769U JP 1987179536 U JP1987179536 U JP 1987179536U JP 17953687 U JP17953687 U JP 17953687U JP H0183769 U JPH0183769 U JP H0183769U
Authority
JP
Japan
Prior art keywords
container
fitting ridge
wall
synthetic resin
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987179536U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0512207Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987179536U priority Critical patent/JPH0512207Y2/ja
Publication of JPH0183769U publication Critical patent/JPH0183769U/ja
Application granted granted Critical
Publication of JPH0512207Y2 publication Critical patent/JPH0512207Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP1987179536U 1987-11-24 1987-11-24 Expired - Lifetime JPH0512207Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987179536U JPH0512207Y2 (en]) 1987-11-24 1987-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987179536U JPH0512207Y2 (en]) 1987-11-24 1987-11-24

Publications (2)

Publication Number Publication Date
JPH0183769U true JPH0183769U (en]) 1989-06-05
JPH0512207Y2 JPH0512207Y2 (en]) 1993-03-29

Family

ID=31471084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987179536U Expired - Lifetime JPH0512207Y2 (en]) 1987-11-24 1987-11-24

Country Status (1)

Country Link
JP (1) JPH0512207Y2 (en])

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187142U (ja) * 1982-06-08 1983-12-12 住友金属鉱山株式会社 スプ−ルケ−ス
JPS6152674U (en]) * 1984-09-12 1986-04-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187142U (ja) * 1982-06-08 1983-12-12 住友金属鉱山株式会社 スプ−ルケ−ス
JPS6152674U (en]) * 1984-09-12 1986-04-09

Also Published As

Publication number Publication date
JPH0512207Y2 (en]) 1993-03-29

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